无铅水性高温电子浆料的研究进展  

Research progress in lead-free and waterborne electronic pastes of high sintering temperature

作　　者：罗世永[1] 李继忠[2] 许文才[1] 李东立[1] 

机构地区：[1]北京印刷学院印刷包装材料与技术北京市重点实验室,北京102600 [2]北京科技大学材料科学与工程学院,北京100806

出　　处：《电子元件与材料》2007年第10期1-3,7,共4页Electronic Components And Materials

基　　金：北京市优秀人才培养资助项目(20061D0500400145);北京市教委科技发展计划资助项目(KM200610015002);北京市属市管高等学校人才强教-学术创新团队资助项目PHR(IHLB17000168)

摘　　要：综述了高温电子浆料用无铅低熔玻璃和水性载体的发展现状。磷酸盐、钒酸盐、铋酸盐玻璃体系是目前含铅低熔玻璃的取代物。水性载体的研究重点在于合成新型或改性的水溶性聚丙烯酸、醇酸树脂、聚氨酯、聚乙烯醇、环氧树脂等以及与它们配套的水性分散剂、流平剂、消泡剂等助剂;其中改性聚丙烯酸将有可能在高温电子浆料中率先应用。The research progress in the lead-free low melting points glasses and aqueous vehicles for preparation of electronic pastes was reviewed. The phosphate, vanadate and bismuthate contained glasses are promising candidates for the substituting of the lead glasses currently most used by the electronic pastes. The research of aqueous vehicles should be focused on the syntheses of the water-solubility new or modified polymers such as polyacrylic acid, alkyd resin, polyurethane, polyvinyl alcohol, epoxy resin, etc as well as the suitable additives of dispersants, leveling agents, and antifoaming agents. Modified polyacrylic acid aqueous vehicle may be the headmost applied in electronic pastes of high sintering temperature.

关 键 词：电子技术 高温电子浆料 综述 无铅低熔玻璃 水性载体 

分 类 号：TN604[电子电信—电路与系统]