真空浸渍树脂法制备烧结金属材料金相样品  

SINTERED METAL MATERIAL MATALLOGRAPHY SAMPLES BY VACUUM PRESSURE IMPREGNATION RESIN METHOD

作　　者：黄志锋[1] 褚胜林[1] 张灵芝[1] 王守仁[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《理化检验（物理分册）》2007年第10期509-511,519,共4页Physical Testing and Chemical Analysis(Part A:Physical Testing)

摘　　要：详细介绍了真空浸渍树脂法制备金相样品的制备过程。实践表明,采用真空浸渍树脂法能够填充材料表面的连通孔隙,保护原有孔隙的形貌、数量和分布,并能够较好地保护涂层、精细和易碎材料免受机械损伤;且能够防止在研磨和侵蚀的过程中研磨剂和腐蚀剂对样品的污染。The metallography samples fabricated by the vacuum pressure impregnation resin method are introduced in detail. The results show that perfect filled pores in the surface of the materials is achieved by the vacuum pressure impregnation method which protect the morphology, number and distribution, at the same time, the mechanical damages of coating, advanced and fragile materials are avoided. In addition, the sample is kept from contaminating during grinding and erosion.

关 键 词：真空浸渍 金相样品 孔隙 树脂 

分 类 号：TG115.211.2[金属学及工艺—物理冶金]