CoCl_2在Ni-P基化学沉积中的作用  

THE EFFECT OF CoCl_2 ON Ni-P POLYBASIC ELECTROLESS DEPOSIT

作　　者：张敬尧[1] 

机构地区：[1]南京理工大学材料学院,南京210094

出　　处：《腐蚀与防护》2007年第10期529-531,共3页Corrosion & Protection

摘　　要：在Ni-P基化学沉积液中加入氯化钴,得到Ni-Co-P合金镀层,与Ni-P镀层相比较其性能得以改善。研究了氯化钴对化学沉积所起的作用及其影响机制,结果表明:加入适量的CoCl2可有效提高镀层的硬度和耐热溶液腐蚀性能,并能抑制镀层的晶化,提高其晶化温度。The Ni-Co-P electroless deposit coating was obtained by adding CoCl2 to the Ni-P polybasic electroless deposit solution. Compared with that of the Ni-P coating, the property of the Ni-Co-P coating was improved. The effect of CoCl2 on deposit as well as the effect mechanism were studied. The micro-hardness and corrosion resistance of the coating in a hot solution were improved effectively by adding certain CoCl2. The CoCl2 could also prevent the crystallization of the coating and increase the crystallization temperature.

关 键 词：CoCl2 Ni-Co-P镀层 化学沉积 晶化 

分 类 号：TQ153[化学工程—电化学工业]