新型微型继电器用Cu/Pd_(60)复合弹性触点材料  

Study on Cu/Pd_(60) Composite Elastic Contact Material Used for Microrelays

作　　者：熊易芬[1] 卢峰[1] 王健[1] 钱琳[1] 

机构地区：[1]昆明贵金属研究所,云南昆明650221

出　　处：《贵金属》2007年第4期17-20,共4页Precious Metals

摘　　要：制备了新型微型继电器用Cu/Pd60复合弹性触点材料,研究了材料的组织结构,测试了其电学、力学等性能。实验表明,此Cu/Pd60复合材料作为微型继电器弹性触点材料,具有高弹性模量(128.8GPa)、低电阻率(3.28μΩ·cm)和低接触电阻,装机后其使用寿命≥105次,可在某些使用中取代原用的AgMgNi合金和PdAgCuAuPtZn六元合金,是一种达到国内外同类产品先进指标的新型中功率密封微型继电器弹性触点材料。The Cu/Pd60 composite with excellent comprehensive performances was prepared. The electrical and mechanical properties and the effects of heat of the Cu/Pd60 composite were studied. The elastic modulus of the Cu/Pd60 composite is128.8GPa, The resistivity is 3.28μΩ·cm, the contact resistance under the testing conditions is much less than 50mΩ, and the service life is≥105 times, the Cu/Pd6o composite can be used as elastic contacts for microrelays to replace traditionally used AgMgNi and PdAgCuAuPtZn alloys in some cases.

关 键 词：金属材料 Cu/Pd60复合弹性触点材料 微型继电器 

分 类 号：TG146.36[一般工业技术—材料科学与工程]