SiC_p尺寸及含量对SiC_p/Cu基复合材料电学和力学性能的影响  

Effect of SiC_p Size and Content on Electrical and Mechanical Properties of SiC_p/Cu Matrix Composite

作　　者：陆晋[1] 汪建敏[2] 许晓静[3] 

机构地区：[1]江苏大学电气信息工程学院,江苏镇江212013 [2]江苏大学材料科学与工程学院,江苏镇江212013 [3]江苏大学机械工程学院,江苏镇江212013

出　　处：《热加工工艺》2007年第20期36-38,69,共4页Hot Working Technology

摘　　要：以纳米级、亚微米级、微米级三种粒径SiCp和微米级铜粉为原料,采用冷压烧结和热挤压方法制备出三种粒径SiCp/Cu基复合材料,分析和对比了复合材料显微组织的变化,研究了SiCp尺寸及含量对SiCp/Cu基复合材料导电性能和力学性能的影响。结果表明,不同尺寸及含量的SiCp在基体中有不同的分布形式,SiCp/Cu基复合材料具有良好的导电性能,其导电性随SiCp尺寸的增大而增高,随SiCp含量的增高而降低;其力学性能随SiCp尺寸及含量有着复杂的变化规律。Three kinds of SiCp reinforced copper （SiCp/Cu） matrix composites were fabricated by cold-pressed sintering technology and hot-extruding taking SiCp of various grit sizes （a nominal diameter of 30 nm, 130 nm and 14 μm, respectively） and micron Cu powder as the raw materials. The microstructure of the composite was observed by scanning electron microscopy,the effects of SiCD size and content on the electrical and mechanical properties of various SiCD reinforced SiCp/Cu matrix composite were investigated. The results show that SiCD with different size and content is distributed in different form in the matrix,and SiCp/Cu matrix composite possesses excellent electrical conductivity and its electrical conductivity is improved with the increase of SiCD size and with the decrease of SiCD content. But its mechanical properties （such as hardness, tensile strength, elongation and wear-resistance） have the complex rule with SiCD size and content changing.

关 键 词：SICP/CU复合材料 SiCp尺寸 电学性能 力学性能 

分 类 号：TB331[一般工业技术—材料科学与工程]