复合电沉积的影响因素  

Factors affecting composite plating

作　　者：范云鹰[1] 张英杰[1] 董鹏[1] 罗少林[1] 

机构地区：[1]昆明理工大学材料与冶金工程学院,云南昆明650093

出　　处：《电镀与涂饰》2007年第10期4-7,共4页Electroplating & Finishing

基　　金：教育部博士点专项科研基金项目(20050674007);云南省自然科学基金面上项目(2006B0048M)。

摘　　要：根据国内外电沉积金属基复合镀层的研究结果,综述了微粒特性、镀液组成、工艺条件以及其它因素对复合电沉积的影响。提出今后应继续加强在复合电沉积机理方面的研究,以便更深刻、更准确地理解和掌握复合电沉积的各种影响因素,从而更好地对复合电沉积的工艺研究和应用给予指导。The effects of particle property, bath composition, process conditions and other factors on composite electrodeposition were summarized based on the results of research on electrodeposited metal-based composite coatings at home and abroad. The author also suggested that the study on the mechanism of composite electrodeposition should be continued and strengthened for the future with a view to gaining deeper and more accurate understanding and grasping of every kinds of factors affecting composite electrodeposition, and thereby providing better guidance to the research and application of composite electrodeposition process.

关 键 词：复合电沉积 影响因素 固体颗粒 机理 

分 类 号：TG178[金属学及工艺—金属表面处理]