Kovar与K_4玻璃阳极焊接机理及影响因素  

Anodic bonding between Kovar Alloy and K_4 glass

作　　者：王传杰[1] 喻萍[2] 薛锦[2] 

机构地区：[1]集美大学工程技术学院,福建厦门361021 [2]西安交通大学焊接研究所,陕西西安710049

出　　处：《西安科技大学学报》2007年第3期427-430,共4页Journal of Xi’an University of Science and Technology

摘　　要：分析了Kovar合金与K4玻璃阳极焊的结合机理和主要工艺参数对连接过程的影响,提出了金属与玻璃的连接机理为电场和温度场作用下的离子迁移、复合氧化物过渡层的生成和沉积,电压、温度、压力及试样表面质量是影响离子迁移和结合的主要因素,相匹配的热膨胀系数是防止开裂保证良好连接的必要条件。The anodic bonding mechanism between Kovar alloy and K4glass is analyzed and the effects of main technology parameters on bonding process are discussed. It is put forward that ionic migration, creation and deposition of composite oxides under certain temperature and electric field result in good bonding between Kovar alloy and K4 glass. Voltage, temperature, pressure and surface quality of specimen are main factors which affect the ions migration and bonding quality. Suited thermal expansion coefficients is the necessary conditions for preventing cracking and good bonding.

关 键 词：阳极焊 连接机理 离子迁移 

分 类 号：TG456[金属学及工艺—焊接]