Effect of Temperature on the Void Growth in Pure Aluminium at High Strain-Rate Loading  

作　　者：祁美兰 贺红亮 晏石林 

机构地区：[1]Laboratory for Shock Wave and Detonation Physics Research, Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900 [2]School of Sciencej Wuhan University of Technology, Wuhan 430070

出　　处：《Chinese Physics Letters》2007年第8期2271-2273,共3页中国物理快报（英文版）

基　　金：Supported by the National Natural Science Foundation of China and the Science and Technology Foundation of State Key Laboratory of Shock Wave and Detonation Physics under Grant Nos 10476027 and 9140C6701010701.

摘　　要：With the environment temperature varying from 273 K to 773 K, the dynamic process of void growth in pure aluminium at high strain-rate loading is calculated based on the dynamic growth equation of a void with internal pressure. The result shows that the effect of temperature on the growth of void should be emphasized. Because the initial pressure of void with gas will increase and the viscosity of materials will decrease with the rising of temperature, the growth of void is accelerated. Furthermore, material inertia restrains the growth of void evidently when the diameter exceeds 10 μm. The effect of surface tension is very weak in the whole process of void growth.With the environment temperature varying from 273 K to 773 K, the dynamic process of void growth in pure aluminium at high strain-rate loading is calculated based on the dynamic growth equation of a void with internal pressure. The result shows that the effect of temperature on the growth of void should be emphasized. Because the initial pressure of void with gas will increase and the viscosity of materials will decrease with the rising of temperature, the growth of void is accelerated. Furthermore, material inertia restrains the growth of void evidently when the diameter exceeds 10 μm. The effect of surface tension is very weak in the whole process of void growth.

关 键 词：DYNAMIC FRACTURE SOLIDS 

分 类 号：O56[理学—原子与分子物理]