注射成形与压力熔渗方法制备高体积分数SiC_P/Al封装盒体及其导热性能分析  

Fabrication of SiC_p/Al composites with high volume fraction SiC_p by PIM and pressure infiltration

作　　者：褚克[1] 贾成厂[1] 梁雪冰[1] 曲选辉[1] 

机构地区：[1]北京科技大学材料科学与工程学院,北京100083

出　　处：《粉末冶金技术》2007年第5期348-351,共4页Powder Metallurgy Technology

摘　　要：先用注射成形方法制备出SiC预成形坯,然后使用压力熔渗方法将熔融Al熔渗于预成形坯体得到含65%(体积分数)SiC颗粒的SiCp/Al复合材料的封装盒体。SEM分析结果表明,封装盒体中的Al熔渗完全,内部组织均匀,且基本达到完全致密化;XRD分析结果得出,压力熔渗SiCP/Al复合材料中有微量的Al4C3生成,少量Al4C3有利于促进复合材料的导热性能;对于高体积分数SiCP/Al复合材料,界面热阻对材料热导率的影响不可忽略,使用等效粒径和Hasselman-Johnson模型计算本试验制备的SiCP/Al复合材料的界面热阻约为4.68×10-8m2.W/K。　SiC preformed compact was firstly manufactured by Powder Injection Molding（PIM）,and then electronic package box of SiCp（65vol%） /Al composite was prepared by pressure infiltration.SEM analysis indicates that SiCp（65vol%）/Al composites prepared by PIM and pressure infiltration has high density and homogeneous microstructure;XRD analysis indicates that a little Al4C3 is produced in the process of pressure infiltration,which is in favor of the thermal conductivity of the composites.The influence of interface thermal barrier on the thermal conductivity of composites with high particle fraction can not be neglected. The interface thermal barrier of the SiCp（65vol%）/Al composites prepared in this experiment is about 4.68×10^-8m^2·W/K by using equivalent identical particles method and Hasselman-Johnson model.

关 键 词：SICP/AL复合材料 压力熔渗 热导率 界面热阻 

分 类 号：TF124.39[冶金工程—粉末冶金]