瞬间液相连接的过冷连接新工艺  

A NOVEL BONDING PROCESS:SUPER-COOLED TRANSIENT LIQUID PHASE BONDING

作　　者：王学刚[1] 李辛庚[1] 严黔[1] 

机构地区：[1]山东电力研究院特种焊接与新材料实验室,济南250002

出　　处：《金属学报》2007年第10期1096-1100,共5页Acta Metallurgica Sinica

基　　金：国家科技成果重点推广计划项目2005EC000213

摘　　要：提出了瞬间液相(TLP)连接的新工艺——过冷连接工艺,即首先将待连接区域加热至某高温进行短时保温,然后再降至一定温度进行长时保温连接.由于液相经历了一次温度过冷,在液/固界面前沿就形成了成分过冷区,破坏了平衡状态下的界面稳定性,形成胞状界面.随着凝固过程的完成,界面消失,形成跨界面连续晶粒,实现冶金接合.以Fe-Ni基非晶合金为中间层,进行了低碳钢过冷TLP连接实验,并与传统的TLP连接工艺进行了比较.结果表明,过冷TLP连接工艺产生了非平面状界面,并且随着凝固的完成界面消失,形成无界面的组织均匀接头.与传统TLP连接工艺接头相比,过冷TLP连接工艺可大大提高接头冲击韧性,其数值达到母材水平.A novel super-cooled process for transient liquid phase （TLP） bonding was proposed, which is different from conventional TLP bonding in the following： the liquid interlayer （Fe-Ni base amorphous alloy） is treated at a high temperature for a few seconds, and then at a low temperature for a few minutes, both two temperatures are higher than its melting point. Owing to a fall of temperature, a super-cooling of composition is formed at the liquid/solid interface and the interracial stabilities of the equilibrium solidification is broken, resulting in a cellular interface. After the completion of solidification, the interface disappeared, and a seamless joint is produced. The experiment of the novel super-cooled process was carried out using carbon steel as base metal and iron-nickel base amorphous alloy as interlayer, and compared with that of conventional TLP bonding. A non-planar interface formed at the first stage and disappeared at the finally stage during super-cooled bonding, so a homogenous joint without interface was obtained. As the detrimental effect of interface on bond properties is avoided, the impact toughness of joint is improved, which reached the base metal level.

关 键 词：瞬间液相连接 过冷 界面 低碳钢 

分 类 号：TG457.11[金属学及工艺—焊接]