引线框架C194铜合金铸态组织和性能分析  

Microstructure and Properties Analysis of the Lead Frame C194 As-Cast Copper Alloy

作　　者：钟秋生[1] 杨元政[1] 陈小祝 

机构地区：[1]广东工业大学材料与能源学院,广东广州510000 [2]广州钢铁集团广州铜材厂有限公司,广东广州510000

出　　处：《铸造》2007年第10期1044-1047,共4页Foundry

基　　金：广州市科技攻关计划项目(2004Z2-D010)。

摘　　要：研究了工业化不同生产试验批次的C194铜合金引线框架材料铸态组织和性能。结果表明C194的化学成分、加料顺序等因素对铸态晶内、晶界的球状第二相Fe3P或Fe2P的大小、分布均匀性有较大影响;添加剂对C194铸坯有明显的晶粒细化作用;其导电率达到14%～20%IACS,维氏硬度在95HV左右。This paper studies the structure and properties of the lead frame c194 As-cast copper alloy producted by using different processes. The results show the grain size and distribution of the C194＇s chemistry composition, order of material adding, etc. as follows influence the second Fe3P or Fe2P spherical phase in the inside or at boundary of a grain. Additive improves the refinement effect greatly on the grains of C194 As-cast copper alloy. The electrical conductivity of as-cast alloy is 14%-20% IACS and its hard is about 95HV.

关 键 词：引线框架 C194合金 铜 导电率 硬度 

分 类 号：TG136.1[一般工业技术—材料科学与工程]