树脂薄片切割砂轮发展方向的探讨  

Discussion on development trend of resin bond abrasive cutting discs in China

作　　者：刘铭[1] 

机构地区：[1]南京航空航天大学

出　　处：《金刚石与磨料磨具工程》2007年第5期71-73,共3页Diamond & Abrasives Engineering

摘　　要：本文介绍了我国树脂切割砂轮存在的结合强度低、磨耗快、结合剂耐热性低、产品用途不分等问题,提出了生产技术向磨料品种与粒度的优化组合、酚醛树脂的改性、网布与填料的灵活运用等专业化方向发展,产品种类向专用化方向发展等观点,以期能够引起读者对树脂薄片砂轮发展方向更多地思考。The paper discussed some problems of resin bond abrasive cutting discs in application, such as ：low bonding strength, quick wornout, low heat resistance of bond, no special-purpose application, etc. Some points are suggested such as： optimal matching of abrasive nature and grit, modification of phenolic resin, flexible application of woven lining and filler, developing special-purpose abrasive products etc.

关 键 词：磨具 薄片切割砂轮 树脂结合剂 

分 类 号：TG74[金属学及工艺—刀具与模具]