基于动态元件匹配的CMOS集成温度传感器设计  

Design of a CMOS Integrated Temperature Sensor Based on Dynamic Element Matching

作　　者：江海[1] 吕坚[1] 徐建华[1] 蒋亚东[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,成都610054

出　　处：《Journal of Semiconductors》2007年第11期1824-1829,共6页半导体学报（英文版）

基　　金：国家杰出青年基金资助项目(批准号:60425101)~~

摘　　要：利用CMOS工艺下衬底型双极晶体管的温度特性,设计了一种精度较高的温度传感器.动态元件匹配的应用很好地解决了由于集成电路工艺误差引起的不匹配对温度传感器性能的影响.采用CSMC0.5μm混合信号工艺仿真,结果显示,该温度传感器精度是0.15℃,线性度是0.15%.多个芯片实测结果表明:温度传感器精度小于0.6℃,线性度小于0.68%,功耗为587μW,芯片面积为225μm×95μm,输出为模拟电压信号,便于采集,为后端处理和应用提供方便.A high accuracy temperature sensor is designed by applying the temperature characteristics of a substrate bipolar transistor in CMOS technology. The use of dynamic element matching enables us to solve problems caused by IC technology mismatching. Simulated results using CSMC 0.5μm mixed signal technology show that the accuracy is 0. 15℃ and the linearity is 0.15%. Measured results of several different chips show that the accuracy is within 0.6℃ and the linearity is within 0.68%. The power dissipation is 587μW and the chip area is 225μm x 95μm. The output is an analog voltage signal, which is easy to collect, process, and apply.

关 键 词：动态元件匹配 衬底型双极晶体管 温度传感器 

分 类 号：TP212.11[自动化与计算机技术—检测技术与自动化装置]