利用嵌入电容提高电性能和减少基板尺寸  

Using Embedded Capacitance to Improve Electrical Performance and Reduce Board Size

作　　者：赵丽[1] 何为[1] 崔浩[1] 何波 张宣东 徐景浩 关健 

机构地区：[1]电子科技大学应用化学系,成都610054 [2]珠海元盛电子科技有限公司技术中心,珠海519060

出　　处：《印制电路信息》2007年第11期36-40,共5页Printed Circuit Information

摘　　要：介绍3MTM嵌入电容材料应用于无源器件的各种优势。3MTM嵌入电容材料具有优良的电性能,在许多OEM设计里成功地取代基板表面的分立去耦电容器,并大大减少基板尺寸对系统成本有明显影响,还与标准的PCB材料的挠性和刚性、工艺兼容,并通过了所有的行业可靠性测试,具有明显的优越性。The paper introduces the 3M^TM Embedded Capacitor Material＇s advantages when the material is utilized in embedded passives. 3M^TM Embedded Capacitor Material has excellent electrical performance, and has been successfully implemented on OEM designs to replace large quantities of discrete decoupling capacitors from the board surface and obviously reduce board size. It has the visible impact on system cost, And the material is compatible with standard flex and rigid PCB materials and processing, passing all the industry reliability tests.

关 键 词：3M^TM嵌入电容材料 电容消去 兼容性 

分 类 号：TN41[电子电信—微电子学与固体电子学]