W-35% Cu粉末形变强化复合材料组织及性能研究  

Microstructure and properties of W-35wt% Cu powders composite consolidated by deformation strengthening

作　　者：于洋[1] 王尔德[1] 刘祖岩[1] 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,黑龙江哈尔滨150001

出　　处：《材料科学与工艺》2007年第5期645-648,653,共5页Materials Science and Technology

基　　金：国家自然科学基金资助项目(50575050).

摘　　要：为了提高W-Cu复合材料的致密度,采用机械球磨-冷压制坯-液相烧结-热静液挤压-热处理工艺,制备出微观组织弥散分布、性能优异的W-35%Cu复合材料.采用扫描电镜、电子探针等测试手段分别对烧结及挤压后材料的组织及性能进行了分析.实验结果表明,采用机械球磨技术制备的W-35%Cu复合粉,经液相活化烧结后,再经热静液挤压进一步形变和致密,材料的硬度以及导电性能都有较大提高.在800℃真空热处理2h后,获得了硬度高于200HB,电导率高于40m/Ω.mm2的W-35%Cu形变复合材料.In order to improve the densification of W - Cu composites, mechanical milling,liquid phase acti- vation sintering, and hot hydrostatic extrusion technologies were used. Then advanced W- 35wt. % Cu com- posites with dispersion microstructure were fabricated. Scanning electronics microscopy and electronics probe analysis were used. The results show that the deformation processed composite with high hardness and high e- lectrical conductivity can be achieved by mechanical milling, liquid phase activation sintering, hot hydrostatic extrusion and vacuum heat-treatment at 800 ℃ with holding time 2 hours. The maximum specific conductance of W - 35wt. % Cu composites can reach 40 m/Ω · mm^2 and the hardness is higher than 200HB.

关 键 词：W-CU复合材料 机械球磨 液相活化烧结 形变强化 热静液挤压 

分 类 号：TG146.3[一般工业技术—材料科学与工程]