Synthesis and properties of nanocrystalline nonferrous metals prepared by flow-levitation-molding method  

作　　者：刘伟 杨天足 楚广 罗江山 唐永建 

机构地区：[1]School of Metallurgical Science and Engineering,Central South University [2]Institute of Laser Fusion, China Academy of Engineering Physics

出　　处：《中国有色金属学会会刊：英文版》2007年第6期1347-1351,共5页Transactions of Nonferrous Metals Society of China

基　　金：Project(10475069) supported by the National Natural Science Foundation of China

摘　　要：Nanocrystalline nonferrous metals (Cu, Al, and Ag) were synthesized by flow-levitation-molding method. The microstructure of the as-prepared nanocrystalline metals was characterized by XRD and FESEM. The microhardness and electrical resistivity were tested by the HMV-2 type Microhardness Tester and 6157 type Electrometer, respectively. The synthesis process was also studied. The results show that the spheriform particles in nanocrystalline metals have average grain size of 20-30 nm. The relative density of nanocrystalline Cu, Al, and Ag are 95.1%, 98.1% and 98.3%, respectively. The microhardness of nanocrystalline Cu, Al and Ag are 2.01, 2.11 and 1.26 GPa respectively, which are larger than those of their coarse-grained counterparts by the factor of 4.5, 14, and 2.5, respectively. The electrical resistivity of nanocrystalline Cu at room temperature is 1.5×10-7 Ω·m, which is higher than coarse-grained Cu by a factor of 7.5. The pressure is the predominant factor influencing the density of the as-prepared nanocrystalline nonferrous metals.Nanocrystalline nonferrous metals （Cu, A1, and Ag） were synthesized by flow-levitation-molding method. The microstructure of the as-prepared nanocrystalline metals was characterized by XRD and FESEM. The microhardness and electrical resistivity were tested by the HMV-2 type Microhardness Tester and 6157 type Electrometer, respectively. The synthesis process was also studied. The results show that the spheriform particles in nanocrystalline metals have average grain size of 20-30 nm. The relative density of nanocrystalline Cu, A1, and Ag are 95.1%, 98.1% and 98.3%, respectively. The microhardness of nanocrystalline Cu, Al and Ag are 2.01, 2.11 and 1.26 GPa respectively, which are larger than those of their coarse-grained counterparts by the factor of 4.5, 14, and 2.5, respectively. The electrical resistivity of nanocrystalline Cu at room temperature is 1.5× 10^-7Ω.m, which is higher than coarse-grained Cu by a factor of 7.5. The pressure is the predominant factor influencing the density of the as-prepared nanocrystalline nonferrous metals.

关 键 词：纳米晶体蛋白 非铁材料 密度 显微硬度 

分 类 号：TB383.1[一般工业技术—材料科学与工程]