新型芳杂环氧树脂的固化动力学及耐热性  

Investigation on Curing Kinetics and Thermal Properties of New Epoxy Resin Having Aromatic Heterocyclic Ring

作　　者：卢晓东[1] 黄玉东[1] 张春华[1] 

机构地区：[1]哈尔滨工业大学应用化学系,黑龙江哈尔滨150001

出　　处：《高分子材料科学与工程》2007年第6期120-123,共4页Polymer Materials Science & Engineering

基　　金：国家自然科学基金资助项目(50333030);黑龙江杰出青年基金资助项目(JC04-12)

摘　　要：通过动态差式扫描量热法(DSC)确定了TDE-85环氧树脂与DIABO/DDS混合芳香胺固化体系的固化工艺,对该体系的固化反应动力学及耐热性进行了研究。采用Kissinger和Ozawa方法计算了体系的固化反应表观活化能,平均值为64.63 kJ/mol,结合Crane公式求出反应级数为0.95,利用FT-IR方法计算体系的固化度为0.98,扭辫法测得的Tg为261℃,热失重曲线表明,体系的起始分解温度为374.4℃,残碳量为44.58%;与TDE/DDS体系相比分别提高了近18%,8%和50%。Curing procedure, reaction kinetics parameters and thermal resistance of TDE-85/ DIABO/DDS was investigated by DSC in this paper. According to Kissinger and Ozawa methods, the average apparent activation energy is 64. 63 kJ/mol. Reaction order is 0. 95. Glass transition temperature is 261 ℃ by TBA. The onset decomposition temperature is 374.4 ℃ and char resident is 44.58%. The data are raised more 18%, 8% and 50% than TDE/DDS system, respectively.

关 键 词：环氧树脂 动力学 耐热性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]