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作 者:王永祯[1,3] 王爱玲[2] 许并社[3] 贾海涛[2]
机构地区:[1]太原理工大学材料科学与工程学院,山西太原030024 [2]中北大学机械工程与自动化学院,山西太原030051 [3]太原理工大学教育部新材料界面科学与工程重点实验室,山西太原030024
出 处:《功能材料》2007年第A09期3624-3627,共4页Journal of Functional Materials
基 金:教育部高校博士学科点专项基金资助项目(20050204JJ);山西省自然科学基金资助项目(20051028)
摘 要:依据SiC晶须增强树脂基复合材料的光固化实验结果,运用材料的温度应力原理,利用降温等效体积应变与光固化体积收缩率关系的假设,建立了有限元模型。研究并分析了树脂基体中组分配比、光固化层厚和晶须增强体对成型件收缩应力的影响。结果表明:树脂基体中组分配比和晶须增强体对收缩应力的影响很大,而光固化层厚对收缩应力的影响较小。In this paper, the finite element model was built according to the experimental result of SiC whisker reinforced resin matrix composites by UV cured. It based on applying the method of temperature stress principle and the assumption of the relation of equivalent cooling cubic strain and cured cubic shrinkage. The effect of shrinkage stress of molding was studied, including the mixture ratio of resin matrix constituent, layer thickness variation of UV cured and whisker reinforce body. The results show that mixture ratio of resin matrix constituent and whisker reinforcing body had a great effort to molding shrinkage stress, while layer variation thickness of UV cured had a small effort to it.
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