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作 者:秦国义[1,2] 蔡洪中[3] 王剑华[4] 赵怀志[3] 陈亮维[3]
机构地区:[1]昆明理工大学材料与冶金工程学院,云南昆明650093 [2]云南大学先进材料工程研究中心,云南昆明650091 [3]昆明贵金属研究所,云南昆明650106 [4]云南省新材料制备与加工重点实验室,云南昆明650093
出 处:《功能材料》2007年第A10期4047-4050,共4页Journal of Functional Materials
基 金:云南省应用基础研究基金资助项目(2003E0082M)
摘 要:采用超音速电弧喷射雾化制备Ag-40%(原子分数)Cu共晶合金粉末,用X射线衍射、扫描电镜等对其凝固行为进行研究。结果表明:粉末为球形颗粒,粒径分布90%集中在15~60μm之间、平均粒径为35gm;冷却速率在10^5~10^7K/s范围,最大过冷度不小于232K;粉末富Ag相的平均点阵参数为0.401877nm,Cu的平均扩展固溶度为20.15%(原子分数),直径≤50μm时,点阵参数为0.39252nm,Cu的固溶度达到40%(原子分数),凝固组织为单相亚稳固溶体;对快速凝固行为进行了分析讨论。Spherical particles of Ag-40at%Cu eutectic alloy were prepared by ultrasonic arc spray atomization process. The particle size of the alloy powders ranged mainly from 15um to 601μm, the average particle size was about 35μm; The cooling rate of droplets have been obtained from10^5K/s to10^7K/s, The largest undercooling of the droplets were ≥232K; The average lattice parameter of rich-Ag in the alloy powders and the average extended solid solution of Cu in the Ag were 0.401877nm and 20at% respectively. The lattice parameter of rich-Ag and extended solid solution of Cu in the Ag were 0.39252nm and 40at% respectively, while the particle size is ≤50μm, the microstructure of the particles is single phase metastable fcc solid solutions. Rapid solidification behaviours were discussed through the paper.
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