热致形状记忆高分子材料的研究现状和进展  

Status and Progress of the Study on Thermostimulative Shape Memory Polymers

作　　者：陆丽浓[1] 马伟[1] 

机构地区：[1]天津科技大学材料科学与化学工程学院,天津300457

出　　处：《化学与粘合》2007年第6期428-431,共4页Chemistry and Adhesion

摘　　要：热致形状记忆高分子(TSMP)材料是指在一定温度下变形并能在室温固定大部分形变且长期存放,当再升温至某一特定温度时,制件能很快回复到变形前形状的一种重要的新型功能材料。由于其采用温度控制、方法简单、加工容易,近年来得到了很大发展并日益引起了人们的广泛关注,现已广泛应用于电子通讯、医疗器械、机械制造、日常用品及农业能源等领域。主要综述了热致形状记忆高分子材料的机理、表征和制备方法,并进一步评述了最近的一些研究现状、应用前景以及发展趋势。Therraostimulafive shape memory polymers （TSMPs） are important new functional materials which can retain a temporary shape after pre -deformation at an elevated temperature and subsequent cooling to a room temperature. When reheated, the original shape can be recovered soon. TSMPs have been improved rapidly and gained great interest because of the simple way that they are controlled by temperature and ease of processing. Now they have been applied largely in the fields of electronic communications, medical instruments, mechanical manufactures, dally necessities, agricultural energy and so on. The mechanism, characterization and the preparation of the thermostimulative shape memory polymer are reviewed. Then their recent research progress, potential applications and developing prospects are introduced.

关 键 词：热致形状记忆高分子 交联 研究进展 

分 类 号：TQ322.99[化学工程—合成树脂塑料工业]