超声波工艺条件对化学镀层的影响  

Effect of the Technological Condition in Ultrasonic Field on the Performance of Electroless Plating

作　　者：杨培燕[1] 宫丽[1] 顾宝珊[1] 孙华杰[1] 

机构地区：[1]钢铁研究总院,北京100081

出　　处：《表面技术》2007年第6期61-63,共3页Surface Technology

摘　　要：研究了超声波在化学镀中的作用机理，通过沉积速率、孔隙率测定以及利用扫描电子显微镜（SEM）观察镀层表面形貌等试验手段，对超声波的功率大小、频率大小和温度等工艺参数如何影响镀层性能进行了分析，结果表明：随着超声波功率的提高，化学沉积速率逐渐提高，当超声功率达到150—200W时，沉积速度达到最大值；提高镀液的温度，可以加快超声镀层的沉积速度；高频镀层的沉积速率比低频的提高将近1．5倍，孔隙率降低60％左右．所得镀层更为均匀致密。The mechanism of ultrasonic and the influence of rate, appearance and performance of electroless plating were discussed power, frequency and temperature on deposition It was shown that with increase of the power and temperature, the deposition rate of plating was increased, but when the value of power reach 150 ～ 200W, the deposition rate achieve the maximum; the deposition rate and appearance of plating with high frequency was faster and more compact than low frequency.

关 键 词：化学镀 超声波 机理 工艺条件 沉积速率 孔隙率 

分 类 号：TQ153[化学工程—电化学工业]