YL12/Cu/0Cr18Ni9Ti异种材料扩散连接接头微观分析  

Microstructural Characterization of the YL12/Cu/0Cr18Ni9Ti Diffusion Bonded Joint

作　　者：成小乐[1] 高义民[1] 邢建东[1] 杨建[1] 廖熠[1] 

机构地区：[1]西安交通大学金属强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2007年第A03期488-491,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金项目资助(50471034)

摘　　要：选取纯铜箔作过渡层,采用真空热压扩散工艺,在加热温度480～500℃、压力10MPa、真空度1.0×10^(-2)Pa工艺条件下,制备了变形铝合金LY12和不锈钢0Cr18Ni9Ti双金属复合材料。利用扫描电子显微镜(SEM)、电子探针(EPMA)、X射线衍射(XRD)、显微硬度(HV)等测试分析方法对双金属复合材料的两个连接界面及基体进行组织及性能分析。结果表明:不锈钢—纯铜界面形成了宽为1.5μm的互扩散区,但其过渡区无金属间化合物生成;铝/铜界面生成了宽约35μm的扩散过渡区,过渡区的相组成为金属间化合物Al_4Cu_9,Al_2Cu。Wrough aluminium alloy LY12 and 0Cr18Ni9Ti stainless-steel discs were joined at 480-500℃, 10 MPa and 1.0 × 10^-2Pa by solid state diffusion bonding, making use of Cu foil acting as thermal stress relief interlayer. The microstructure of the two interfaces thus formed, that is, YL 12/Cu and Cu/0Cr18Ni9Ti was investigated by a variety of characterization techniques such as SEM, EPMA, XRD and Vickers microhardness. The results showed that non intermetallic compound were detected within Cu/0Cr18Ni9Ti interface; adjacent to the YL12/Cu interface a 35 μm-thick layer were found to obtain Al4Cu9 and Al2Cu.

关 键 词：扩散连接 变形铝合金 小锈钢 界面 

分 类 号：TG115[金属学及工艺—物理冶金]