扩散连接Al/Cu/0Cr18Ni9Ti复合材料界面生长机理研究  

Study on the Intermetallic Compound and Its Growth of Al/Cu/0Cr18Ni9Ti Diffusion Bonded Joint

作　　者：成小乐[1] 高义民[1] 邢建东[1] 廖熠[1] 尹敏[1] 

机构地区：[1]西安交通大学 金属强度国家重点实验室,陕西西安710049

出　　处：《稀有金属材料与工程》2007年第A03期627-630,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(50471034)

摘　　要：采用真空热压扩散连接法制备出冶金结合的钢铜铝复合材料,采用电解腐蚀法对所制备的复合材料从铜侧进行分层腐蚀,并结合扫描电镜(SEM)、能谱分析(EDS)和X射线衍射(XRD)对所腐蚀德连接界面的各个扩散层进行了形貌、成分、相分析。结果表明:铜/铝界面,从铜侧到铝侧以次为铝在铜中的固溶体,CugAl_4和CuAl2;不锈钢/铜界面为铜在不锈钢中的固溶体。研究得到了适用于本实验条件下的铝铜金属间化合物生长方式。The vacuum warm compaction diffusion method is used to prepare the Al/Cu/0Cr18Ni9Ti composite; electrochemical corrosion is used to gradation etch the Cu and the interface of Al/Cu; and further the scanning electron microscopy （SEM）, electron probe microanalysis （EPMA） and X-ray diffractometer （XRD） are used respectively to analyze the gradation etched interface. The following results are obtained： under the condition of two steps diffusion bonding, the composite is well bonded with the joint less than 9μm of intermetallic compound in the Al/Cu joint, 1.5μm solid solution formed in the Cu/0Cr18Ni9Ti diffusion zone; through the four stages growth, two kinds of intermetallic compound formed in the interface of Al/Cu, CugAl4 adjacent to the Cu side and CuAl2 adjacent to the Al side. The growing model of Al/Cu intermetallic compounds is found suitable for the condition of the experiment by this study.

关 键 词：金属间化合物 电化学腐蚀 连接界面 

分 类 号：TB33[一般工业技术—材料科学与工程]