半导体纳米微粒在聚合物基体中的复合与组装  

The Compositing and Assembling of Semiconductor Nanoparticles in Polymer Matrix

作　　者：杨柏[1] 黄金满[1] 郝恩才[1] 沈家骢[1] 

机构地区：[1]吉林大学化学系,长春130023

出　　处：《高等学校化学学报》1997年第7期1218-1226,共9页Chemical Journal of Chinese Universities

基　　金：国家自然科学基金

摘　　要：总结了有关半导体纳米微粒在聚合物基体中的制备、复合与组装及性能研究等工作，对半导体纳米微粒的尺寸大小、粒度分布、表面修饰、复合过程及组装维数等控制问题进行了讨论．In this paper, some research work of ours was summarized which concerns thepreparation, compositing, assembling and properties of semiconductor nanoparticles in poly-mer matrix. Some questions such as particle size, size distribution, surface modifying, com-positing process and assembling dimension were discussed.

关 键 词：聚合物基体 复合 组装 半导体 纳米微粒 

分 类 号：TN304.504[电子电信—物理电子学] O631.3[理学—高分子化学]