镀金触点表面的微孔率测试  

Microporosity Measurement on the Surface of Gold Plated Contacts

作　　者：李璇[1] 林雪燕[1] 

机构地区：[1]北京邮电大学电接触科研室,北京100876

出　　处：《电子质量》2007年第3期37-39,共3页Electronics Quality

摘　　要：镀金触点表面的微孔率是表征镀层质量的重要指标,它表明了镀层对基体防护作用的优劣程度。为了减少传统微孔率测量方法造成的人工误差,采用了数字化采集镀层表面图象和软件分析统计的方法。镀层表面微孔总面积是微孔数量和面积的集中体现,应作为评判镀层质量的最主要指标,在面积相同的情况下通过比较微孔率可得出镀层的质量等级。通过对样片的接触电阻的测试验证了这一测试方法的正确性。将此微孔率的测试方法运用于比较实验室模拟环境实验和自然环境长期暴露实验的结果,从而得出实验室模拟环境实验的加速因子。Microporosity of the Surface of Gold Plated Contacts which indicates the protection performance of plating layers to matrix is an important index for quality of plating surface features. For reducing the artificial error caused by traditional microporosity measuringmethod, a new digital image capturing for plating surface and software analysis statistics methods are used. The total area of pores on plating surface represents the pore’s quantityand area. It should be taken as the most important index for accessing the quality of platinglayer. The quality class is acquired by comparing the microporosity when the pore’s areasare the same. The contact resistance testing for sample layer has proved the method is correct. The acceleration factor of simulated environment in lab is acquired when the microporosity measurement method is used for comparing the results between simulated environment in lab and natural environment.

关 键 词：腐蚀 微孔 接触电阻 加速因子 

分 类 号：TQ153[化学工程—电化学工业]