高铌含量Ti_3Al基合金的扩散连接  

Diffusion bonding of high Nb-content Ti_3Al-based alloy

作　　者：谢二虎[1] 邹贵生[1] 白海林[1] 吴爱萍[1] 王庆[1] 任家烈[1] 

机构地区：[1]清华大学机械工程系先进成形制造教育部重点实验室,北京100084

出　　处：《清华大学学报（自然科学版）》2007年第11期1945-1948,共4页Journal of Tsinghua University(Science and Technology)

基　　金：清华大学基础研究基金资助项目(Jcqn2005011)

摘　　要：为获得高强度的Ti3Al基合金接头,采用热-力学模拟试验机Gleeble 1500D进行了Ti-23Al-17Nb合金的高真空扩散连接的研究。结果表明,增大连接压力、提高连接温度以及延长保温时间能促进接头界面的焊合,但也会导致接头变形加大和基体相B2的粗化。优化的连接温度、连接压力和保温时间分别为980℃、7 MPa和30 min,其接头室温和650℃拉伸强度为921 MPa和639 MPa,分别达到了原始母材对应温度下的强度的95%和91%。低连接参数下的接头断裂发生于结合界面,而高连接参数下的接头断裂发生于远离结合界面的母材中,其断裂方式属于准解理断裂。High vacuum diffusion bonding of Ti 23Al-17Nb alloy was performed using the thermal mechanical simulator Gleeble 1500D to obtain high-strength joints in a TiaAl-based alloy. Tests show that large bonding parameters favor interracial bonding but increase the deformation ratio of the joints and coarsen the B2 matrix phase. The optimal bonding temperature is 980℃, the pressure is 7 MPa and the holding time is 30 min with average joint tensile strengths at room temperature of 921 MPa and at 650℃ of 639 MPa, 95% and 91% of the base materials＇ strengths. Tensile fractures for these joints with small bonding parameters occur at the bonding interface, while joint fractures with large bonding parameters occur in the base materials away from the bonding interface in the quasi-cleavage fracture mode.

关 键 词：TI3AL基合金 扩散连接 界面结合 接头强度 

分 类 号：TG454[金属学及工艺—焊接]