热处理工艺对锡须的形成与长大影响  

Effect of Heat Treatment on the Formation and Growth of Tin Whisker

作　　者：肖代红[1] 宋旼[1] 陈康华[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,湖南长沙410083

出　　处：《金属热处理》2007年第11期88-90,共3页Heat Treatment of Metals

基　　金：国家重点基础研究项目(G2005CB623704);中国博士后科学基金(20070410986)

摘　　要：用扫描电镜观察分析、研究了不同热处理工艺对共晶Sn-Cu电镀层上锡须的形成与生长影响。结果表明,高温高湿处理易促使锡须的形成与长大,经过一定的时间后,锡须生长速度减缓;循环热处理或室温处理对锡须的形成与长大影响较小;施加恒定拉力后进行室温处理,锡须的形成完全受到抑制,其形成与长大是由于电镀层中存在压应力,促使镀层中的锡再结晶并长大成锡须。The effect of heat treatment on the formation and growth of tin whisker from eutectic Sn-Cu electroplated coating was investigated by use of scanning electron microscopy（SEM）.It is shown that the unbiased temperature ＆ humidity accelerates the formation and growth of tin whisker.However,thermal shock or ambient temperature storage do not obviously promote the formation and growth of tin whisker.When adding tensile stress in ambient temperature storage,the formation of tin whisker is completely inhibited.The compressive stress is necessary condition leading to recrystallization and tin whisker growth.

关 键 词：电镀层 锡须 热处理 压应力 

分 类 号：TG146.14[一般工业技术—材料科学与工程]