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作 者:柯刚[1] 浣石[1] 刘晓国[2] 蒋国平[1] 冯踊跃[3]
机构地区:[1]广州大学工程抗震研究中心 [2]广州大学化学化工学院,广州510006 [3]武汉大学分析测试中心,武汉430072
出 处:《工程塑料应用》2007年第12期18-21,共4页Engineering Plastics Application
摘 要:以综合性能优异的烯丙基化聚苯醚(PPO)为基础树脂,采用质量分数为10%的双(3-乙基-4-马来酰亚胺基苯)甲烷(BEDM)作为烯丙基化PPO的交联剂,无引发剂热聚合得到一种均一透明的、介电常数(ε)和介电损耗角正切(tanδ)均低、玻璃化转变温度(Tg)较高、吸水率低的新型热固性PPO树脂。对烯丙基化PPO/BEDM体系的非等温固化动力学进行研究,计算得到其固化反应级数为0.95,固化反应表观活化能为160.43kJ/mol,以及频率因子和反应速率常数等数据。同时确定了该体系的固化工艺参数。BEDM改性烯丙基化PPO固化树脂的Tg为208.24℃,ε(1MHz)为2.87,tanδ(1MHz)为0.011,吸水率为0.28%,能满足高性能印制电路板用树脂的要求,具有较好的应用前景。With allylated poly(phenylene oxide)(PPO) which had well combined properties as matrix resin, bis(3-ethyl-4- maleimidophenyl) methane (BEDM)( 10% weight of PPO) as crosslink agent, a novel unifrom and transparent thermosetting resin of PPO which had low dielectric constant (ε), dielectric loss and water absorption, as well as high glass transition temperature ( T ) was obtained. Nonisothermal curing kinetics of the PPO resin modified with the BEDM was investigated, and the euring reaction order (n) , apparent activation energy (E), frequency factor (A) and rate constant(k) at different heating rates were obtained,n and E were 0.95 and 160.43 kJ/mol, respectively. Curing process parameters of the BEDM/PPO resin were obtained also. Furthermore, values of the Tg ,ε( 1 MHz) ,tangent of the dielectric loss angle ( tanδ, 1 MHz) and water absorption of the cured BEDM/PPO resin were determined to he 208.24℃ , 2.87, 0.011 and 0.28% , respectively. The BEDM/PPO resin could meet the requirements of the PCB with high performances, and it had a better prospect of application.
分 类 号:TQ326.53[化学工程—合成树脂塑料工业]
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