SiC颗粒表面修饰对铜基复合材料性能的影响  

Effect of SiC particle surface modification on properties of Cu-matrix composites

作　　者：王德宝[1] 吴玉程[1] 王文芳[1] 宗跃[2] 

机构地区：[1]合肥工业大学材料科学与工程学院,合肥230009 [2]合肥工业大学复合材料公司,合肥230009

出　　处：《中国有色金属学报》2007年第11期1814-1820,共7页The Chinese Journal of Nonferrous Metals

基　　金：安徽省"十五"科技攻关计划资助项目(040020392);合肥市重点科技攻关计划资助项目(20051004);安徽省自然科学基金资助项目(070414180)

摘　　要：采用粉末冶金结合化学沉积工艺制备SiC颗粒增强铜基复合材料。研究在SiC颗粒表面修饰不同金属(铜、镍)对复合材料界面结合状况的作用,并比较两种金属涂层各自对材料性能的影响。结果表明:SiC颗粒经表面修饰铜、镍后,复合材料界面结合紧密,界面结合强度提高,在基体和增强颗粒之间可以有效传递载荷,使得复合材料的相对密度、宏观硬度和力学性能获得提高。由于基体铜和镍镀层之间可以相互扩散,形成连续固溶层,从而使复合材料力学性能提升更为显著,但是由于在修饰镍过程中引入少量镍磷化合物夹杂,所以材料的导电、导热性能没有获得明显改善。Copper-matrix composites reinforced with SiC particles were fabricated by powder metallurgy plus electroless deposition. The effects of modification with different metals （Cu, Ni） on SiC particle surface on the interracial bonding and properties of composites were investigated. The results indicate that the interface of composites is compact, the interracial bonding strength is improved, and the loads can be transferred effectively between matrix and SiC by the surface modification with Cu and Ni. Therefore, the densification, macrohardness and mechanical properties of composites are improved. The atoms in matrix and Ni coating can diffuse to each other to form a continual film of solid solution, which is in favor of improving mechanical properties of composites. The electrical conductivity and thermal conductivity of composites, however, are not obviously improved because of introducing nickel phosphide during the process of electroless nickel plating.

关 键 词：铜基复合材料 表面修饰 界面优化 力学性能 

分 类 号：TB331[一般工业技术—材料科学与工程] TG146.11[金属学及工艺—金属材料]