含铜高纯净钢时效过程中铜偏聚区的演变  

Evolution of Cu clusters during aging process of high purity steel containing Cu

作　　者：王海燕[1] 安治国[2] 任慧平[1] 刘宗昌[1] 王玉峰[1] 

机构地区：[1]内蒙古科技大学材料与冶金学院,内蒙古包头014010 [2]北京科技大学新金属材料国家重点实验室,北京100083

出　　处：《材料热处理学报》2007年第6期67-70,共4页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(50361001);内蒙古科技大学校内基金(KJ200608)

摘　　要：利用高分辨透射电镜研究了含铜高纯净钢时效过程中铜偏聚区的形貌与结构变化,分析了含铜钢的时效强化机制。结果表明,含铜钢固溶态与时效初期铁素体基体存在铜原子偏聚区,随时效时间延长,在时效硬度峰处铜偏聚区演变为富铜的亚稳Fe-Cu颗粒,该富铜析出相与基体呈半共格关系,其周围与内部存在的高密度位错与层错构成位错运动的阻碍,这可能是导致含铜钢时效强化的主要原因。The morphology and structure of Cu clusters in high purity steel containing copper was investigated by high resolution electron microscopy in the process of aging at 550℃ for the time from 100s to 100h. In addition, the aging strengthening mechanism was discussed. The results show that Cu atom clusters exist in ferrite matrix in solid solution state and at initial stage of aging, subsequently, cu-rich meta-stable Fe- Cu particles precipitate at the peak aging, which is very important concerning the aging strengthening mechanism. It is found that there are high-density dislocations and stacking fault dispersed in the cu-rich particles that forms the obstacle of the dislocation motion, which should be the main reason of aging strengthening effect in steels containing copper.

关 键 词：含铜高纯净钢 铜偏聚区 强化 

分 类 号：TG142.1[一般工业技术—材料科学与工程]