单晶Cu键合丝制备过程中的影响因素研究  

Study on Effect Factor for Preparation Process of Single Crystal Copper Bonding Wire

作　　者：丁雨田[1] 曹军[1] 胡勇[1] 寇生中[1] 许广济[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃兰州730005

出　　处：《铸造技术》2007年第12期1648-1651,共4页Foundry Technology

基　　金：甘肃省科技攻关项目(2GS064-A52-036-05)

摘　　要：针对单晶Cu键合丝制备过程中的影响因素进行了系统分析,通过研究单晶Cu键合丝制备过程中坯料、模具、润滑、清洗及其制备和热处理过程中张力对单晶Cu键合丝性能和表面质量的影响,得出良好的坯料组织性能,模具定径区的高度光洁和圆整,有效的润滑和清洗及制备过程中精确的张力控制,是获得良好单晶Cu键合丝的关键。The effect factor for preparation process of single crystal copper bonding wire were systematic analyzed, and the ingot, mould, lubrication, cleaning and tension in preparation and heat treatment were investigated, and found that the key factors of get the excellent single crystal copper bonding wire were the excellent microstructure propriety of ingot, the shape and smoothness of calibrating strap, effective lubrication and cleaning and precision tension controlling.

关 键 词：单晶Cu键合丝 坯料 模具 润滑 张力 

分 类 号：TG291[金属学及工艺—铸造]