低温镀铁工艺的优化及故障处理  

Optimization and troubleshooting of low-temperature iron plating process

作　　者：杨森[1] 刘忆[2] 殷锦捷[1] 韩辉[1] 

机构地区：[1]辽宁工程技术大学材料系,辽宁阜新123000 [2]徐州工程学院机电分院,江苏徐州221008

出　　处：《电镀与涂饰》2007年第12期4-5,9,共3页Electroplating & Finishing

摘　　要：通过正交试验,以沉积速率、显微硬度、腐蚀速率为评价指标,得出低温镀铁的最佳工艺参数为:ρ(FeCl2·4H2O)=400g/L,θ=50°C,pH=1.0,Jk=14A/dm2。在最佳工艺条件下,镀层的沉积速率为342.50μm/h,显微硬度为707HV,中性盐雾试验中腐蚀速率为0.50g/(m2·h),其结合力好,表面光亮,无针孔或结瘤。提出了低温镀铁的故障处理方法。Optimal process parameters for low-temperature Fe plating were obtained by orthogonal test with deposition rate, microhardness and corrosion rate as evaluation indexes： 400 g/L FeCl2·4H2O, temperature 50℃, pH 1.0 and current density 14 A/dm^2. The deposit prepared under optimal conditions is free of pinholes and nodules, and has a deposition rate of 342.50 μm/h, microhardness of 707 HV, corrosion rate of 0.50 g/（m^2.h） in neutral salt spray test, good adhesion and bright surface. The troubleshooting for Fe plating at low temperature was presented.

关 键 词：镀铁工艺 低温 优化 正交试验 故障处理 

分 类 号：TQ153.19[化学工程—电化学工业]