某电子设备通风口布局优化设计  

The Layout Optimization Design for the Vents of Certain Electronic Equipment

作　　者：张永存[1] 刘鹏[1] 刘书田[1] 胡洞民[1] 王丰芝[1] 

机构地区：[1]大连理工大学工业装备结构分析国家重点实验室/工程力学系,辽宁大连116023

出　　处：《电子机械工程》2007年第6期20-23,42,共5页Electro-Mechanical Engineering

基　　金：国家自然科学基金(10332010;10421202);国家重点基础研究(973)计划(2006CB601205);教育部新世纪优秀人才支持计划资助

摘　　要：以某电子设备的热结构设计为例,利用CFD技术探讨了系统级的强迫风冷散热问题。在内部结构一定的条件下,设计通风口和风扇的布局,以优化设备内部流场,从而提高设备的散热性能。通过比较两种不同风扇功率下设备的散热性能,讨论了风扇配置与设备散热效率之间的关系。结果表明,合理的通风口和风扇的布局可以显著地提高电子设备的散热性能。风扇数目的增加只有在对设备内部流场进行优化的条件下才能提高设备的散热性能。增大风扇功率可以提高电子设备的散热效果,但其散热效率并不一定理想。Taking the thermal design of certain electronic equipment as an example, the convection air cooling of electronic equipment in the system level is discussed. Under the constraint of unchanging the inner structures of the equipment, the distribution of the inlet vent and fans is designed to optimize flow field, which can improve the heat dissipation capability of the equipment~ Two kinds of fans are compared. The relation be- tween fan capability and the heat dissipation efficiency of the equipment is investigated. The results suggest that the rational distribution of the inlet vent and fans can improve the heat dissipation of the electronic equip- ment significantly. The increase of numbers of the fans can improve the heat dissipation capability of the equipment only when the inner flow field is optimized. Meanwhile, increasing the fan power can improve the heat dissipation capability of the equipment, but its efficiency is not necessarily ideal.

关 键 词：电子设备 热设计 布局优化 

分 类 号：TN830.5[电子电信—信息与通信工程] TK124[动力工程及工程热物理—工程热物理]