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机构地区:[1]西安交通大学金属材料强度国家重点实验室,陕西西安710049
出 处:《热加工工艺》2007年第23期82-85,共4页Hot Working Technology
基 金:国家留学基金委的资助
摘 要:综述了金属基复合材料中增强体/基体(R/M)界面接合类型,对比了焊接条件下与制备条件下R/M界面结合特征的差别。据此首次提出将界面分为一次界面与二次界面的分类方法;进而提出了钎焊与液相扩散焊热循环中R/M界面演变行为模式,即一次界面的损伤/解体与二次界面的重建。讨论了R/M界面演变行为及其对接头强度的直接与间接影响。The types of reinforcement/matrix (R/M) interface bonding in metal matrix composite (MMC) were reviewed, and the differences in the interfacial bonding characteristics between prior-joining and post-joining were compared. Based on above analysis, the interface was classified into the primary interface and secondary interface; then the interface evolution model during the thermal cycle in brazing and transient liquid phase bonding was proposed, which consists of the damage/failure of the primary interface and the restoration of the secondary interface. Furthermore, the interface evolution behavior and its direct and indirect effects on joint strength were discussed.
分 类 号:TB333[一般工业技术—材料科学与工程] TG454[金属学及工艺—焊接]
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