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出 处:《天津科技大学学报》2007年第4期44-48,共5页Journal of Tianjin University of Science & Technology
基 金:国家863计划资助项目(2001AA337070)
摘 要:利用ANSYS有限元分析软件建立了铸嘴支撑面板温度-应力耦合分析的三维有限元计算模型.为了优化面板内的应力分布,减小热位移,特别是与铸嘴平面稳定性直接相关联的竖直方向热位移,对面板进行了结构改进,并对实际工况下面板的热应力分布进行了计算研究.研究结果表明:面板内存在显著的热应力,应力集中现象明显;面板总体上出现了较大的热位移,特别是在竖直方向,热位移量为最大,导致面板因变形过大失效.改进后面板的热应力在总体数值上有所升高,但应力集中现象有所改善,在竖直方向的热位移量已显著减小,能很好地满足电磁铸轧的工艺要求.A three-dimensional FEM calculating model for thermo-stress coupling analysis was developed with finite element software package ANSYS to calculating the thermal stress distribution in supporting nozzle plane board. To optimize the distribution of thermo-stress in plane board and reduce the thermal displacement, especially to reduce the upright thermal displacement that associates with the plane stability of nozzle, the plane board's structure was improved, and the calculating research of the thermal stress distribution was prosecuted in factual technics conditions. The research results show that the thermo-stress is remarkable in plane board, and the stress concentration is distinctly. Biggish thermal displacement exists in plane board, especially on the upright orientation, the thermal displacement value is maximal, which is the main reason that causes the deformation failure. The then-no-stress in optimized plane board is increased a little, but the stress concentration is improved, and the thermal displacement value is decreased remarkably. The results prove that the optimized structural plane boards adapt to technics'request perfectly.
分 类 号:TH123.4[机械工程—机械设计及理论]
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