连接参数对Ti-22Al-25Nb合金TLP扩散连接接头性能的影响  

Effects of bonding parameters on the properties of TLP diffusion bonding joints of Ti-22Al-25Nb O-phase alloy

作　　者：邹贵生[1] 谢二虎[1] 白海林[1] 吴爱萍[1] 任家烈[1] 王庆[1] 

机构地区：[1]清华大学机械工程系和教育部先进成形制造重点实验室,北京100084

出　　处：《焊接技术》2007年第6期15-17,共3页Welding Technology

基　　金：清华大学基础研究基金项目(Jcqn2005011)

摘　　要：研究了用Ti-15Cu-15Ni合金薄片TLP扩散连接O相合金Ti-22Al-25Nb。结果表明,短时间保温时接头连接区还残留了含微量Al和Nb的Ti2(Cu,Ni)与Ti(Cu,Ni)脆性组织;保温时间足够长且采用快速冷却工艺时,连接区组织为B2相,反之,慢速冷却工艺下连接区组织为基体相B2和一定量的α2,O相。与快速冷却工艺相比,慢速冷却措施可改善连接区组织和明显提高接头强度,在连接温度为990℃并保温90min的优化工艺下,接头在室温和650℃的抗拉强度分别为1041MPa和659MPa,达到原始母材强度的95%和81%。The transient liquid phase (TLP) diffusion bonding of Ti-22Al-25Nb O-phase alloy using Ti-15Cu-15Ni film as interlayer has been studied on thermal-mechanical simulator Gleeble 1500D. The results show that the brittle microstructures of Ti2(Cu,Ni) and Ti(Cu,Ni) containing a small amount of Al and Nb elements were remained in the bonding zone when using short holding time. The bonding zone was composed of pure B2 phase when the holding time was long enough and a rapid cooling technology was utilized. However, the bonding zone consisted of B2 matrix and second phases of α2 and O when using a slow cooling technology. A slow cooling technology was beneficial to improving the microstructures and strengths of the joints, and the maximum tensile strengths of the joints at room temperature and 650 ℃ under the conditions of bonding temperature 990 ℃ for 90 min reached up to 1 041 MPa and 659 MPa, which are equal to 95 % and 81% of base material themselves, respectively.

关 键 词：O相合金 TLP扩散连接 接头强度 

分 类 号：TG407[金属学及工艺—焊接]