基片下磁场中溅射镀铜薄膜及其微结构  

Cu films sputtered with applied magnet under substrate and their microstructures

作　　者：顾佳烨[1] 狄国庆[1,2] 储开慧[1] 

机构地区：[1]苏州大学物理系 [2]苏州大学江苏省薄膜材料重点实验室,苏州215006

出　　处：《功能材料与器件学报》2007年第6期625-629,共5页Journal of Functional Materials and Devices

基　　金：江苏高校自然科学重大基础研究项目部分资助(No.05KJA43006)

摘　　要：介绍了基片下外加磁场的方法来溅射制备铜膜的实验,结果发现薄膜的表面形貌和微结构与平常磁控溅射法所得的有很大的不同。在溅射过程中等离子体的发光也明显增强。相同的输入功率下,自偏压较磁控溅射有明显下降。研究认为产生以上现象的原因是实验中采用的特殊装置产生的磁镜效应对溅射空间大量离子作用的结果。A new method was presented to deposit Cu thin films with applied magnet under substrate in the magnetron sputtering apparatus. It is found that the films＇ surface morphology are different with the samples prepared by the normal methods. During deposition, it is also found the glow of the discharged plasma became very bright. With the same input power, self - bias voltage became smaller comparing with the magnetron sputter. The reason of the phenomenon was discussed and they were caused by the effect of the magnetic mirror on ions in the space.

关 键 词：溅射 外加磁场 磁镜 爱里斑 薄膜 

分 类 号：O484.1[理学—固体物理] O532.11[理学—物理]