组件裂尖变形场的云纹显微倍增研究  

STUDY OF CRACK TIP SINGULARITY OF MODULE BY MICRO MULTIPLICATION MOIRE INTERFEROMETRY

作　　者：史训清[1,2] 戴福隆[1,2] 刘宝琛[1,2] 

机构地区：[1]北京航空航天大学动力系 [2]清华大学力学系

出　　处：《力学学报》1997年第4期448-455,共8页Chinese Journal of Theoretical and Applied Mechanics

基　　金：国家自然科学基金

摘　　要：将云纹干涉法与显微、倍增技术相结合，发展了一种位移场云纹条纹显微倍增方法．对该方法进行了严格的理论推导和精确的实验验证。A micro multiplication moire interferometry method with high spatial resolution and superhigh sensitivity is proposed by combining the traditional moire interferometry with magnification and multiplication techniques. The interference theory is given and the demonstrated experiment is conducted successfully. Then, this new method is applied to the study of the displacement fields and singularity around interlayer crack tip of the simulated microelectronic module under different thermal loadings.

关 键 词：显微倍增 云纹法 裂纹尖 变形场 微电子组件 

分 类 号：TN407[电子电信—微电子学与固体电子学] O348.12[理学—固体力学]