硫脲加速和稳定化学沉积镍的机理  

ACCELERATION AND STABLIZATION MECHANISM OF ELECTROLESS NICKEL DEPOSITION BY THIOUREA

作　　者：韩克平[1] 方景礼[1] 

机构地区：[1]南京大学

出　　处：《应用科学学报》1997年第2期229-233,共5页Journal of Applied Sciences

摘　　要：测定了硫脲对化学沉积镍的速度、析氢量、极化曲线和稳定电位的影响，并结合对沉积镍层的X射线光电子能谱（XPS）分析，探讨了硫脲对化学沉积镍过程的加速和稳定机理．Influences of thiourea on electroless nickel deposition rate, hydrogen evolution, polarization curves and stationary potential wore determined. Together with the X-ray photoelectron spectroscopy (XPS) analysis of the deposit. the mechanism for acceleration and stabilization of electroless nickel deposition by thio-urea has been discussed.

关 键 词：化学沉积 镍 硫脲 耐蚀性 耐磨性 

分 类 号：TG174.44[金属学及工艺—金属表面处理]