高性能PCB用热塑性树脂膜“IBUKI”  

Thermoplastic Resin Film "IBUKI" for High-Performance PCB

作　　者：蔡积庆（编译） 

机构地区：[1]江苏南京,210018

出　　处：《印制电路信息》2008年第1期24-28,共5页Printed Circuit Information

摘　　要：概述了耐热性、尺寸稳定性、高频特性,一次多层性和异种材料粘结性优良的热可塑性树脂膜"IBUKI"的开发。它适用于无芯全层IVH一次多层板,嵌入LSI一次多层板、空腔基板、复合基板和弯曲基板之类的高性能PCB用绝缘基材。This paper describes the development of heat plastic resin film ＂IBUKI＂ having excellent heat resistauce, size stability, high frequency characteristic, Single multilayer and heterogeneoous material bonding. It is suitable to isolation laminate for high performance PCB such as coreless all layer IVH Single multilayer board, LSI buried single multilayer board, cavity board, complex board and deflection board.

关 键 词：热可塑性树脂膜 高性能PCB 一次多层 复合 空腔 

分 类 号：TN41[电子电信—微电子学与固体电子学]