316不锈钢滤板上钯银合金的脉冲电镀  

Pulse Electrodeposition of Palladium Silver Alloy on a Type 316 Stainless Steel Filter in Plate

作　　者：邢丕峰[1] 赵鹏骥[1] 毛欣根[1] 候键平 

机构地区：[1]中国工程物理研究院核物理与化学研究所,成都610003

出　　处：《高技术通讯》1997年第5期51-54,共4页Chinese High Technology Letters

基　　金：863计划资助

摘　　要：研究了氨性溶液中在316不锈钢滤板上脉冲电沉积把银合金时，电镀条件对镀层组成、表观形貌和金相结构的影响。镀层由钯银合金和少量游离银组成，合金相具有面。C立方结构，择优取向为（111）面。镀层银含量随平均电流密度或导通时间的增大而减少，提高镀液中银的浓度有利于获得高银含量镀层。银含量小于26at．％的镀层外观光亮。研究证明钯银合金和银的沉积速率受控于银氨给离子的传质过程。确定了钯银合金选择渗氢膜的电镀工艺条件。Effects of pulse plating conditions on the composition, appearance and morphology of Pd/Ag deposits on the filter plate of Type 316 stainless steel from ammoniacal bath have been described in this paper. The platings consist of Pd/Ag alloy and a little free silver, in which the alloy lattices are deformed f. c. c. with a preferential orientation of the (111) plane. The silver content of the deposits decreases with an increase of the average current density or the on-time. The coatings with a silver content less than 26at. % have the bright appearance. The research indicates that the deposition rates of the alloy and silver are controlled by the diffusion of ammine silver complex ion in the bath. The pulse plating conditions for Pd/Ag alloy' s selection of H-permeable films are determined.

关 键 词：钯银合金 渗氢膜 脉冲电镀 

分 类 号：TQ153.2[化学工程—电化学工业]