不同络合剂的化学镀铜  

Chemical plating copper at different complexing agent

作　　者：刘少友[1] 杨红芸[1] 龙成 

机构地区：[1]凯里学院应用化学研究所,贵州凯里556000 [2]丹寨县第二中学,贵州丹寨557500

出　　处：《凯里学院学报》2007年第6期37-40,共4页Journal of Kaili University

基　　金：凯里学院院级重点规划课题(编号:2005037);贵州省教育厅自然科学基金资助课题(编号:2004222)

摘　　要：以硫酸铜(CuSO4.5H2O)为主盐,分别研究了以乙二胺四乙酸二钠(Na2EDTA)和柠檬酸钠(Na3C6H5O7.2H2O)作为单一络合剂的化学镀铜工艺.通过化学抛光液对施镀基体的前处理以及对镀铜液的TU-1900型紫外-可见吸收光谱分析,探讨了镀液光谱曲线变化与沉铜速率、镀液稳定性的内在联系.结果表明,镀液吸收光谱的红移与蓝移主要通过体系中水合铜离子与氢氧化铜的配位数的多少及其量的多少来体现,沉铜速率与光谱曲线的红移呈正相关性,镀液的稳定性与吸收光谱的峰的多少和峰值的大小呈负相关性.以Na2EDTA为络合剂的镀液比以Na3C6H5O7.2H2O为络合剂的体系稳定,有效的反应只能在稳定的光谱曲线和一定的浓度范围内进行.The recipes of electroless copper plating with cupric sulfate as essential ingredient and disodium ethylene diamine tctraacetate （Na2 EDTA） or sodium citrate （Na3 C6 H5O7·2H2O） as complexing agent were studied. Through pretreating finish to substrate surface with chemical glossing agent and analyzing the curve of OV-Vis spectrophotometry in electroless copper plating solution, the changes between absorption spectrum curve , deposition rate and stability of electroless copper solution were determined. It was showed that the red shift or blue shift of absorption spectra curve was represented by aquated copper ion and cupric hydroxide coordination number ＆ its amounts. Positive correlation between deposition rate and the red shift of spectra curve was obtained, and negative correlation on absorbance and the number of absorption spectra as well as stability of electroless copper solution was got. And the electroless copper plating system with Na2EDTA was more stabilizer than with Na3C6H5O7·2H2O. Moreover, the reaction of plating copper was only producted within the stabile spectra curve and a certain concentration range of electroless copper solution.

关 键 词：吸收光谱 沉铜速率 稳定性 乙二胺四乙酸二钠 柠檬酸钠 

分 类 号：TQ153.14[化学工程—电化学工业]