乙醇胺碱性蚀铜液的研究  

Study on an Ethanolamine-containing Alkaline Etching Solution

作　　者：李德良[1] 王丹 罗洁[1] 龙丽娟[1] 彭芸[1] 

机构地区：[1]中南林业科技大学环境工程研究所,湖南长沙410004 [2]长沙意贯环保高新技术有限公司,湖南长沙410008

出　　处：《表面技术》2008年第1期28-31,共4页Surface Technology

基　　金：国家科技部2005年度创新基金资助项目(05C26224301143)

摘　　要：为了开发一种新型碱性蚀刻液以代替传统的氨类蚀刻液，该蚀刻液的组成特点是以铜一乙醇胺络合物、氯离子和碱性pH缓冲液作为主要成分。分别采用静态吊片蚀刻法和动态喷淋蚀刻研究方法探索了其最佳配方和操作条件，结果表明在铜离子浓度为85～95g／L，氯离子浓度3．5～4．5mol/L，乙醇胺浓度4．5～5mol/L，添加剂浓度0．5～1．5g／L，pH为8．5～9．0，操作温度为55～60℃时，其蚀刻状态最佳，相应的静态和动态蚀刻速率分别达6μm/min和20μm/min，与氨类蚀刻液的对应指标相当，且防侧蚀指标更高。结论是该碱性蚀刻液在生产配制、使用和再生循环过程中无废气排放，技术指标优越，具有良好的工业应用前景。An environment-friendly alkali-etcher was studied to replace the traditional ammonia etcher. It was characterized by the solution containing copper-ethanolamine complex, chlorine and alkali-buffer as the main components. Static and spray etching methods were used to get its optimum operating parameters. The results show that the novel etcher is as good as ammonia type in its quality index especially for the undercutting factor, and can meet the PCB standards. Its etching rate reaches 6μm/min and 20μm/min for static and spray process respectively, when maintaining its copper concentration （ 85 - 95 ） g/L, chlorine （ 3.5 - 4.5 ） mol/L, ethnolamine （ 4.5 - 5 ） mol/L, additive （ 0. 5 - 1.5 ） g/L , pH 8.5 - 9.0 and temperature （55 - 60 ） ℃ . It can be concluded that the novel etcher is a competitive alternative for the etching process, and will benefits the PCB consumers in high quality and no discharge of waste gas in its making-up, usage including regeneration and recycling, and after-use treatments.

关 键 词：蚀铜液 乙醇胺 蚀刻速率 侧蚀因子 

分 类 号：TG178[金属学及工艺—金属表面处理]