TATB基高聚物粘结炸药残余应力的测试和消除研究  

Testing and Relieving of Residual Stress for Polymer Bonded Explosive Based on TATB

作　　者：周红萍[1] 李敬明[1] 李丽[1] 韦兴文[1] 张伟斌[1] 温茂萍[1] 

机构地区：[1]中国工程物理研究院化工材料研究所,四川绵阳621900

出　　处：《含能材料》2008年第1期37-40,共4页Chinese Journal of Energetic Materials

基　　金：中物院化工材料研究所所长基金资助(62601040310)

摘　　要：以TATB基高聚物粘结炸药(PBX)为对象,采用盲孔法测定了PBX炸药的初始残余应力及其分布,研究了孔深和钻孔后应变读数时间对结果的影响,以及样品热处理后对残余应力松弛的影响。结果表明:孔深3 mm和钻孔后10 min的应变读数时间是适宜的实验参数。热处理能够明显降低和均化PBX炸药内部的残余应力,75℃热处理3天能消除50%的残余应力并趋于稳定。The initial residual stress of the polymer bonded explosive based on TATB and its distribution were tested by blind-hole drilling method. The effects of hole depth and time of strain record on the testing result and the effects of heating treatment on residual stress relaxation were studied. The results show that 3 mm hole depth ,and 10 rain time of strain records are suitable experimental parameters. The residual stress reduces to about 50% and tends to be steady by heating treatment at 75 ℃ for 3 days.

关 键 词：材料力学 TATB基高聚物粘结炸药 残余应力 盲孔法 热处理 

分 类 号：TQ560.72[化学工程—炸药化工]