Effect of 3-Amino-5-mercapto-1,2,4-triazole on Electroless Nickel Deposition  

作　　者：LIU Hai-ping LINing BI Si-fu LI De-yu ZOU Zhong-li 

机构地区：[1]Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, P. R. China

出　　处：《Chemical Research in Chinese Universities》2008年第1期101-105,共5页高等学校化学研究（英文版）

基　　金：Specialized Research Fund for the Doctoral Program of Higher Education(No.20030213007);Heilong-jiang Province Natural Science Foundation(No.E0325)

摘　　要：The effects of organic additive, 3-amino-5-mercapto-1,2,4-triazole （AMTA） on bath stability, deposition rate, reaction activation energy, and Ni-P coating composition in acidic electroless nickel plating were investigated. Polarization curve method and infrared reflection spectroscopy were used to analyze the mechanism of the effect of AMTA on electroless nickel deposition. It was observed that AMTA improved bath stability, decreased the deposition rate, and increased the reaction activation energy. It was also revealed that AMTA decreased the phosphorus content and increased the sulfur content in Ni-P coating. In addition, AMTA inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni^2＋. Infrared reflection spectroscopy result indicates that AMTA was adsorbed on the surface of Ni-P and interacted with Ni^2＋ to form an AMTA-Ni^2＋ compound. On the basis of the results of this study, the mechanism of the effect of AMTA on electroless nickel deposition was deduced.The effects of organic additive, 3-amino-5-mercapto-1,2,4-triazole （AMTA） on bath stability, deposition rate, reaction activation energy, and Ni-P coating composition in acidic electroless nickel plating were investigated. Polarization curve method and infrared reflection spectroscopy were used to analyze the mechanism of the effect of AMTA on electroless nickel deposition. It was observed that AMTA improved bath stability, decreased the deposition rate, and increased the reaction activation energy. It was also revealed that AMTA decreased the phosphorus content and increased the sulfur content in Ni-P coating. In addition, AMTA inhibited the anodic oxidation of hypophosphite and accelerated the cathodic reduction of Ni^2＋. Infrared reflection spectroscopy result indicates that AMTA was adsorbed on the surface of Ni-P and interacted with Ni^2＋ to form an AMTA-Ni^2＋ compound. On the basis of the results of this study, the mechanism of the effect of AMTA on electroless nickel deposition was deduced.

关 键 词：Ni-P electrode STABILIZER Deposition rate Adsorption 

分 类 号：TG174.41[金属学及工艺—金属表面处理]