散热模块材料对ATCA主板散热性能影响研究  

THERMAL PERFORMANCE OF ATCA MOTHERBOARD WITH DIFFERENT HEAT SINK MATERIALS

作　　者：董志忠[1] 孟勐[1] 梁展鹏[1] 彭晓峰[1] 

机构地区：[1]清华大学热能工程系,北京100084

出　　处：《工程热物理学报》2008年第3期482-484,共3页Journal of Engineering Thermophysics

摘　　要：CPU发热量迅速增加已经成为影响整个处理系统能否正常运行的关键因素,具有多个CPU的服务器级主板散热问题更加显得突出.本文根据ATCA服务器级主板设计要求,通过实验测试以及数值模拟分析,揭示出铜质热沉与铝质热沉在不同空气流量下对整个主板散热能力的影响,提出进一步改善散热效果的方法和技术途径.Nowadays, the great increase of the power of CPU has become a very serious problem to the whole processing system, especially the one with more than one CPU＇s. According to the cooling design requirements of ATCA system, present study indicated that, based on experiment and numerical simulation, copper and aluminum heat sink would bring different cooling effect to the whole system. Furthermore, several ways of improvement are discussed in present paper.

关 键 词：ATCA主板 散热器 铜质热沉 铝质热沉 

分 类 号：TK124[动力工程及工程热物理—工程热物理]