真空浸渍树脂法制备金相样品的研究  

Preparation of metallography samples by vacuum impregnation of resin

作　　者：黄志锋[1] 褚胜林[1] 张灵芝[1] 王守仁[1] 

机构地区：[1]中南大学粉末冶金国家重点实验室,长沙410083

出　　处：《粉末冶金技术》2008年第1期53-56,共4页Powder Metallurgy Technology

摘　　要：详细介绍了真空浸渍树脂法制备金相样品的制备过程。实践表明:采用真空浸渍树脂法能够很好地填充材料表面的连通孔隙,保护原有孔隙的形貌、数量和分布;能够较好地保护涂层、精细和易碎材料免受机械损伤;能够防止样品在研磨和侵蚀的过程中研磨剂和腐蚀剂的污染。The metallography samples fabricated by the vacuum impregnation of resin are introduced. The results show that perfectly filled pores in the surface of the materials are achieved by the vacuum impregnation method which keeps the morphology, number and distribution of original pores unchanged, the mechanical damages of coating, fine and fragile materials are avoided. In addition, lapping agent and erodent are kept from contaminating samples during grinding and erosion.

关 键 词：真空浸渍 金相样品 孔隙 树脂 

分 类 号：TB332[一般工业技术—材料科学与工程] TG115.211[金属学及工艺—物理冶金]