片式元件与钢球自动分离机的设计  

Design of the Automatic Machine for Separating the Chip Electronic Component From the Steel Balls

作　　者：吕玉山[1] 王军[1] 陈非 陆芳纳 陈昆 

机构地区：[1]沈阳理工大学,辽宁沈阳110168 [2]广东风华高科技股份有限公司,广东肇庆526060

出　　处：《电子工艺技术》2008年第1期35-39,共5页Electronics Process Technology

摘　　要：为了解决片式元件滚镀电极后将元件与电镀辅助钢球分离的问题,分析了各种分离原理与方法中存在的问题,确定了斜面振动分离技术,并开展了相应分离机的设计理论的探讨,给出了振动分选机构、上料机构和角度调整机构设计思想以及系统的电器控制方法与选型技术等,获得了一台能够满足元件生产需要的分选机。In order to solve the problem of separating the chip electronic component from the admix- ture which are composed of the chip electronic components and the steel balls when the components are electroplated, the mechanisms of some methods about separating the chip electronic components from the steel balls are discussed and the a new separating method are advanced, which is based on the vibration part feeding technology of the inclined plane. Then design theory on the automatic separating machine are also analyzed or discussed, and the some designing thought, including the vibrating separating mechanism, the feeding mechanism of parts, the adjusting angle mechanism of the vibrating plate, and the controlling methods of the machine and so on, are put across. At last, a separating machine that can fulfill the chip electronic component fabrication has been obtained.

关 键 词：片式电阻 片式电子元件 分离机 振动上料器 

分 类 号：TN605[电子电信—电路与系统]