硅树脂805的裂解过程及高温连接陶瓷性能研究  

Study on Pyrolysis Process and Joining Performance of Silicone Resin 805

作　　者：刘洪丽[1] 曲立杰[1] 刘冬梅[1] 

机构地区：[1]佳木斯大学材料科学与工程学院,黑龙江佳木斯154007

出　　处：《新技术新工艺》2008年第2期73-75,共3页New Technology & New Process

基　　金：黑龙江省教育厅科学技术研究项目资助(11511382);黑龙江省普通高校青年学术骨干支持计划项目资助(1151G049);黑龙江省自然科学基金项目资助(E2007-23)

摘　　要：研究了硅树脂805的裂解过程，在此基础上采用硅树脂805高温连接氮化硅结合碳化硅陶瓷，研究了连接温度、连接压力以及活性填料对连接性能的影响。结果表明，在1000-1400℃范围内，随着温度的升高，硅树脂裂解产物发生了由非晶态向晶态的转变。采用单一硅树脂805为连接剂时，连接温度、连接压力对连接强度均有较大影响，当连接温度为1200℃，连接压力为100kPa时，连接试样抗弯强度达70．5MPa。硅树脂中加入适量的活性填料-纳米Al粉可有效地提高连接强度，同时降低连接温度，连接温度为1100℃所获连接试样抗弯强度达最大值102．6MPa。微观结构分析显示，连接层结构较为均匀致密，连接层与母材间界面接合良好。The pyrolysis process of silicone resin 805 is investigated in this paper, and joining of Si3N4/SiC ceramic to itself is realized using the silicone resin 805 as joining material. XRD analysis indicates that within the tested range of 1000℃~1400, the pyrolyzate of silicone resin 805 transforms from amorphous ceramic to crystal with the increasing of the temperature. The joining strength of the joints is strongly affected by the joining temperature and joining pressure. Adding Al nanopowder, as an active addition, can enhance the joining strength and reduce joining temperature. The maximum bending strength of the joints is 102.6MPa. This value is obtained at the joining temperature of 1100℃. Microstructural studies reveal that the joining interlayer is uniform and densified. Good contact at the interfaces is visible on the SEM photograph.

关 键 词：硅树脂 裂解 陶瓷连接 活性填料 

分 类 号：TG146.4[一般工业技术—材料科学与工程]