环氧树脂/双环戊二烯双酚型氰酸酯树脂共聚体系固化动力学研究  

Study on the curing kinetics of epoxy-dicyclopentadiene bisphenol type cyanate ester resin co-polymer system

作　　者：王金合[1] 颜红侠[1] 何少波[1] 张增平[1] 

机构地区：[1]西北工业大学理学院应用化学系,陕西西安710072

出　　处：《中国胶粘剂》2008年第2期6-9,共4页China Adhesives

摘　　要：采用Ozawa方法和Kissinger方法研究了环氧树脂和双环戊二烯双酚型氰酸酯树脂(DCPDCE)共聚体系的固化动力学,并计算了活化能、指前因子、不同温度下的反应速率常数和共聚物的总反应级数。研究结果表明,体系中加入环氧树脂后,提高了体系的反应活化能,明显降低了室温时的反应速率常数,而对固化温度(180℃)时的反应速率常数影响不大。不同环氧树脂含量的共聚体系固化反应级数均接近1级反应。The curing kinetics of epoxy-dicyclopentadiene bisphenol cyanate ester （DCPDCE）resin co-poly mer system was studied by ＇Ozawa＇ and ＇Kissinger＇ methods, and the activation energy, pre-exponential factor, as well as rate constant at different temperatures and total reaction order of the co-polymer were calculated. The resuits showed that after put epoxy resin into system,could enhance the activation energy of the co-polymer and re duce the rate constant at room temperature, but the effects was little on rate constant of curing temperature （180 ℃）. In addition, the total order of the co-polymer at curing reaction system was nearly one order in the difference content of the epoxy resin.

关 键 词：双环戊二烯双酚型氰酸酯树脂 环氧树脂 固化反应动力学 

分 类 号：TQ433.437[化学工程]